Jul 1, 2020 3:17 PM ET
iCrowd Newswire – Jul 1, 2020

The Global Wafer Level Chip Scale Packaging (WLCSP) Electroless Plating Market is estimated to reach 5.9% during the forecast period 2020-2027. As per the detailed market study, the WLCSP electroless plating industry is estimated to reach $2.88 billion by the end of the year 2027.

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Bales Metal Surface Solutions (Bales), ERIE Plating Company, Nihon Parkerizing Co., Ltd., C. Uyemura & Co., Ltd., COVENTYA International, Okuno Chemical Industries Co., Ltd. KC Jones Plating Company, MacDermid, Inc., ARC Technologies, Inc. and Atotech Deutschland GmbH are some major players included in the research study of the global WLCSP electroless plating market.

Electroless plating are also referred as auto-catalytic plating or conversion coating plating. It is being used to form the conductive part of printed circuit boards. The electroless plating process involved placing the part in an aqueous solution. WLCSP is a type packaging technology with an integrated circuit at wafer level. The key advantage of WLCSP include minimized PCB inductance along with reduced package size and enhanced thermal conduction characteristics. Increasing adoption of advanced WLCSP electroless plating is also boosting the demand for high performance chips for a wide range of consumer electronic products. The technology is expected to increase the value of a semiconductor wafer product by increasing and maintaining the performance, adding functionality in its operation while lowering the cost of packaging.

The global (WLCSP) electroless plating market is driven by various growth factors such as increasing demand for microelectronic devices and circuit miniaturization, cost-effectiveness of WLCSP electroless plating and enhanced feature of WLCSP electroless plating with better shielding against traditional plating process. Whereas, price volatility of raw materials and growth of the semiconductor industry impedes the market growth to a certain extent. Furthermore, growth in demand for WLCSP electroless plating in the healthcare and aerospace industries offers lucrative opportunities for the market players operating in the WLCSP electroless plating industry.

Segmentation Overview of the Global WLCSP Electroless Plating Market

The WLCSP Electroless Plating industry is segmented on the basis of type and end use. These major market segments are further categorized into various sub-segments to study the market in detail. These major market segments are studied considering various market determinants and geographical dynamics.

The Type Segment of the Global WLCSP Electroless Plating Market is Sub-Segmented into:

  • Nickel
    • High Phosphorus
    • Medium Phosphorus
    • Low Phosphorus
  • Composite
  • Copper

The End-Use Segment of the Global WLCSP Electroless Plating Market is Sub-Segmented into:

  • Machinery
  • Aerospace
  • Electronics
  • Automotive
  • Others

Geographical Overview of the Global WLCSP Electroless Plating Market

The Asia-Pacific WLCSP electroless plating market hold the dominant market share in the global marketplace considering market revenue. The region holds ~2/3rd of the market share in the WLCSP electroless plating industry in the year 2019. Also, the APAC WLCSP electroless plating market is anticipated to maintain the dominance throughout the forecast period. Additionally, the APAC regional market is estimated to grow at the fastest growth rate with a CAGR of 6.5% during 2020-2027. The regional growth is attributed to growth in manufacturing industries, growth in demand for smart electronics and the large-scale availability of high-end advanced technologies across the region.

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Keywords:    Worldwide Wafer Level Chip Scale Packaging (WLCSP) Electroless Plating Market